| Thermal analyses of clay-H3P04 system were studied in view of
beneficial effect of clay in phosphate bond by way of increasing workability
and reducing the moisture sensitivity.
The various properties of clay and H3P04 were taken to obtain
P,05/AI20a molar ratios from 0.5 to 3.0. The results of thermal
analyses show that the clay attacks phosphoric acid at as low as
200°-220°C and the product depends upon the P20 5/AI20 3 ratios and
the temperature of reaction. The AI(H,P04) 3, AI,(H,P,O,),
Al(P0a)3, AI(P04) and silico-phosphates are the major products.
With the higher concentration of P,05 there is a tendency to form
silico-phosphates. |