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Transactions of the INDIAN CERAMIC SOCIETY   Vol. 41  1982
A Study of the Clay-Phosphoric Acid System by Thermal Analysis
A. K. RoY AND N. R. SIRCAR
Pages : 101-104
DOI : 10.1080/0371750X.1982.10822584
Abstract
Thermal analyses of clay-H3P04 system were studied in view of beneficial effect of clay in phosphate bond by way of increasing workability and reducing the moisture sensitivity. The various properties of clay and H3P04 were taken to obtain P,05/AI20a molar ratios from 0.5 to 3.0. The results of thermal analyses show that the clay attacks phosphoric acid at as low as 200°-220°C and the product depends upon the P20 5/AI20 3 ratios and the temperature of reaction. The AI(H,P04) 3, AI,(H,P,O,), Al(P0a)3, AI(P04) and silico-phosphates are the major products. With the higher concentration of P,05 there is a tendency to form silico-phosphates.
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