Transactions of the INDIAN CERAMIC SOCIETY Vol. 39 1980
Effect of Lapping and Polishing on the
Strength of Alumina Ceramics
S. K. GUHA AND S. CHATTERJEE
Pages : 127-130
DOI : 10.1080/0371750X.1980.10840734
Abstract
Sintered alumina ceramic substrates are in increasing
demand for use in micro-electronics. Usually, two processes
of manufacturing are industrially employed. Substrates
made by tape casting are commercially available as fired
products without lapjling or polishing; whereas the substrates
made by pressing invariably require polishing to
attain the requisite surface finish. A study was made by
using Instron strength measuring instrument to determine
the decrease in strength on polishing compared to the as
fired products.
It was observed that the decrease in strength was only
marginal, and surface flaws generated by lapping and
polishing are likely to be made up when resistive ink or
paste is printed on the surface and fired thereafter.
