| Characterization of Interfacial Layer Between
Al2O3-(Ag-Cu-Ti) Active Filler Alloy |
Sudipta Mondal, S. K. Das, M. B. Saha and Ajoy Kumar Ray
Pages : 9-14
DOI :10.1080/0371750X.2004.11012122 |
| Abstract |
| An active filler alloy, 97(Ag-28Cu)3Ti has been developed for joining of ceramic-ceramic/metal. The microstructure of the alloy shows the presence of silver-rich bright and copper-rich dark phases. Most of the titanium is associated with copper-rich phase as the solubility of titanium in silver is very low in comparison to that in copper. The cleaned thin foil of 0.1-0.2 mm thick alloy was used for joining of sintered Al2O3-Al2O3 at 800°, 900°, 1000°, 1100° and 1200°C. The brazed samples were characterized by using SEM, EPMA and XRD. The EPMA analyses of the brazed samples show the inter-diffusion of elements across the interface. The inter-diffusion process during brazing was found to be dependent on the concentration of silver and copper present near the interface. The diffusion of titanium from the active filler alloy towards Al2O3 was found to be maximum at the centre of the interfacial zone. The XRD results revealed that during brazing TiO and Ti3Cu3O were formed at the interface. |
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